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Panel Plating – Stratus™ P500

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Panel Plating – Stratus™ P500

  • Classification:Semiconductor

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Panel Plating – Stratus™ P500

ECD 510 x 515 mm Panel Processing

Applications

Configurable for up to 5 metals

  • Multi-chip Fan Out

  • SoC packages

  • MicroLED

Features
  • Wafer level precision hardware and software

  • Cu, Sn(Ag), Ni & Au plating @<10µm L/S

  • Single/Dual sided plating

  • Membrane cells provide high chemistry utilization

  • Multi-zone anodes for optimized uniformity with thick and thin seeds

  • Patterned shields for uniform high throughput plating

Substrates
  • 510×515 mm panels, custom

  • Glass, Composite, Other


Website of this article:http://www.semismt.cn/product/804.html

Tag:AdvancedPackaging,PanelPlating,DepositionSolution

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website::www.semismt.cn

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