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Wafer Plating – Stratus™ P300

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Wafer Plating – Stratus™ P300

  • Classification:Semiconductor

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Wafer Plating – Stratus™ P300

ECD 300 – 200 mm Wafer Processing

Applications

  • Configurable for up to 6 metals

  • UBM/RDL

  • Fan Out

  • RF Filters

  • Power Devices

Features

  • Dual wafer size capability

  • Membrane Cells for long bath stability

  • ShearPlate™ technology for thinnest boundary layer

  • Substrate handling flexibility

Substrates

  • 300 and 200 mm wafers

  • Silicon, eWLB, Bonded, Carrier


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