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SHENZHEN TOPQUALITY INDUSTRY CO,.LTD

SHENZHEN TEPCO ELECTRONIC EQUIPEMENT CO., LTD.

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ASMPT CM-OVEN-S

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ASMPT CM-OVEN-S

  • Classification:Semiconductor

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CM-OVEN-S

The CM-OVEN-S is a snap cure oven that offers both contact cure and air curing for different applications. It also provides a flexible curing profile and time setting, and for inline or standalone operation – depending on your needs. With up to 7 curing zones.

Equipped with a universal cone roller for lead frame transferring, split N2 delivery system with N2 curtains at input and output sides to prevent lead frame oxidation. Electric flow sensor improves monitoring & control of N2 flow, plus a temperature control system with thermocouples at heater block and N2 stream.

Features

  • Flexible curing profile and curing time setting

  • Contact cure and Air curing for different applications

  • Flexible for inline or standalone operation

  • Universal cone roller for LF transferring, no conversion

  • Split N2 delivery system, with N2 curtains at oven’s input and output sides to prevent LF oxidation

  • Electronic flow sensor to improve monitoring and control of N2 flow

  • N2 temperature control system with thermocouples at heater block and N2 stream

  • Effective exhaust system for outgassing suction to prevent LF contamination

  • Dynamic temperature profiling system built into oven

  • Post curing inspection platform provided


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