SHENZHEN TOPQUALITY INDUSTRY CO,.LTD
Contacts：Mr. Xiang +86-15811551336
E-mail：market@topsmt.com
AD280Plus, an Automatic High Precision Die Bonder that achieves ± 3 µm @ 3σ XY placement accuracy with patented pattern recognition. It offers flip chip handling and diverse material compatibility, including wafer, waffle pack, Gel-Pak, tray, tape feeder, or custom options. Enhancing traceability, it incorporates barcode, 2D code, or OCR technology on substrates, wafers, and dies. AD280Plus sets a new standard for precision, versatility, and traceability in die bonding technology.
Achieving ± 3 µm @ 3σ XY placement with patented look-through pattern recognition
Flip chip handling capability
Diverse material handling
Standard: Wafer on expander or clamp ring
Optional: Waffle pack, Gel-Pak, tray, tape feeder or by request
Enhancing traceability by barcode, 2D code or OCR on substrate / wafer / die (Option)
E-mail：market@topsmt.com
Contacts：Mr. Xiang +86-13510329527
website：：www.semismt.cn
