SHENZHEN TOPQUALITY INDUSTRY CO,.LTD
Contacts：Mr. Xiang +86-15811551336
E-mail：market@topsmt.com
Automatic Thermo-compression Bonding System
Flexible materials handling capability for Heterogeneous Integration in 2D, 2.5D and 3D format
Co-exist die input from both wafer and tape & reel
Field configurable for strip / singulated / wafer substrate
Ultra wide carrier handling for singulated substrate
Direct wafer and glass substrate handling with SlimFEM
Reliable with solid installation bases
> 250 sets installation in mass production
Innovative process
Inert environment enables Liquid Phase Contact (LPC) process for high productivity
Real-time active tip tilt
E-mail：market@topsmt.com
Contacts：Mr. Xiang +86-13510329527
website：：www.semismt.cn
