ASM SIPLACE TX series sets the records in placement performance, floorspace performance and placement accuracy in the high-speed segment, which is the first mounter that is capable of placing 0201 (metric) components at top speed.

SIPLACE TX2i Parameters

Placement speed: up to 96,000cph (benchmark), up to 127,600cph (theoretical)

Machine size (length x width x height): 1.00m x 2.23m x 1.45m

Placement heads: SIPLACE SpeedStar (CP20P2), SIPLACE MultiStar (CPP), SIPLACE TwinStar (TH)

Component spectrums: 0.12mm x 0.12mm to 200mm x 125mm

Feeder module: 80 x 8mm tape feeder, JEDEC trays, linear dipping unit, glue feeder

Typical power consumption: 2.0 KW (with vacuum pump)、1.2KW (without vacuum pump)

Compressed air consumption: 120 Nl/min (with vacuum pump)

SIPLACE TX2 Parameters

Placement speed: up to 85,500cph (benchmark), up to 113,600cph (theoretical)

Machine size (L x W x H): 1.00m x 2.25m x 1.45m

Placement heads: SIPLACE SpeedStar (CP20P2), SIPLACE MultiStar (CPP), SIPLACE TwinStar (TH)

Component spectrums: 0.12mm x 0.12mm to 200mm x 125mm

PCB size (L X W): 50mm x 45mm to 550 x 260mm (dual lane)、50mm x 45mm to 550 x 460mm (single lane)

Feeder module: 80 x 8mm tape feeder, JEDEC trays, linear dipping unit, glue feeder

Typical power consumption: 2.0 KW (with vacuum pump)、1.2KW (without vacuum pump)

Compressed air consumption: 120 Nl/min (with vacuum pump)

SIPLACE TX1 Parameters

Placement speed: up to 44,000cph (benchmark), up to 58,483cph (theoretical)

Machine size (L x W x H): 1.00m x 2.25m x 1.45m

Placement heads: SIPLACE SpeedStar (CP20P2), SIPLACE MultiStar (CPP), SIPLACE TwinStar (TH)

Component spectrums: 0.12mm x 0.12mm to 200mm x 125mm

PCB size (L X W): 50mm x 45mm to 550 x 260mm (dual lane)、50mm x 45mm to 550 x 460mm (single lane)

Feeder module: 80 x 8mm tape feeder, JEDEC trays, linear dipping unit, glue feeder

Typical power consumption: 2.0 KW (with vacuum pump)、1.2KW (without vacuum pump)

Compressed air consumption: 70 Nl/min (with vacuum pump)

SIPLACE SpeedStar(CP20P2)

Component spectrums：0.12mm x 0.12mm to 8.2mm x 8.2mm

Component height：4mm

Placement accuracy(3σ)：25μm

Maximum performance(benchmark value)：48,000cph

Placement force：0.5N to 4.5N

SIPLACE MultiStar(CPP)

Component spectrums：01005 to 50mm x 40mm

Component height：15.5mm

Placement accuracy(3σ)：34μm

Maximum performance(benchmark value)：25,500cph

Placement force：1.0N to 15N

SIPLACE TwinStar(TH)

Component spectrums：0201 to 200mm x 125mm

Component height：25mm

Placement accuracy(3σ)：22μm

Maximum performance(benchmark value)：5,500cph

Placement force：1.0N to 30N

Highlights of SIPLACE TX：

New features：

SIPLACE SpeedStar: placement speed 48,000cph, for components up to

8.2 mm x 8.2 mm, placement accuracy up to 25 µm @ 3 sigma

SIPLACE MultiStar: placement speed up to 25,500cph

SIPLACE TwinStar: for special requirement

SIPLACE JEDEC trays: up to 18 JEDEC trays

SIPLACE TX micron: placement accuracy up to 15 µm @ 3 sigma

SIPLACE SpeedStar and SIPLACE MultiStar placement heads can work in the same working area to achieve higher flexibility and placement performance.

Placement force as low as 0.5N for sensitive component.

Touchless placement makes it possible to place highly sensitive component whose weight reaches the maximum placement weight.

New function: SIPLACE Smart Pin Support

Maximum PCB size: 550mm x 460mm