TOP-X3100 X-RAY INSPECTION MACHINE

APPLICATION FIELD
◆ Semiconductor field, for inspecting the internal structure of the IC chip, FC, CSP
◆ Automotive-related aluminum castings, rubber and resin products, for bubble and crack
detection;
◆ BGA on PCB, open circuit, bubble and hollow area size detection and automatic
judgment;
◆ Aviation and military field, wing, warhead, etc;
◆ Pharmaceuticals related lozenge and chemical products of FRP, resin, pottery and
porcelain;
◆ Lithium batteries and electronic components (capacitors, resistors, diodes, LED), such
as the perspective of testing;

FEATURES AND ADVANTAGES
◆ Imported focus X-ray tube (100/130kv
closed tube), high sensitive image
intensifier, 1.3 mega high-speed industrial
digital CCD camera. The sample less than
5 microns can be detected, and the image
display effect is good.
◆ High geometric power, system
magnification, arbitrary adjustment, easy to
find small defects, fast detection speed;
◆ Laser positioning system;
◆ Four axis linkage, CNC batch automatic
detection function, suitable for mass
detection, detection accuracy is high;
◆ Multi-functional software system;
◆ Fully sealed lead frame, in line with the
international and domestic X-ray safety
standards;