Printing accuracy 

≥2 Cpk@±25μm@,6σ

Repeat positioning accuracy  

≥2 Cpk@±10μm@,6σ

Cycle time

7s

Max. printing area  

400mm x340mm

Stencil size

470mm x 370mm~737mm x 737mm

Stencil thickness

25mm -  40mm

Squeegee pressure

0kg -  10kg

Printing speed

1mm/sec -  200mm/sec

Printing clearance

0mm -  20mm

Demoulding parameters

speed:0.1 -  20mm/s   distance:0mm -  3mm  

Demoulding method

Optional squeegee up first or demoulding first

For material

Solder paste, ink, Ag paste

Transporting PCB

Description

Belt type

U-type gear belt, front rail fixed

ESD compatibility 

black transportation belt and rail surface resistivity＞110Ω

Width adjustment   

Programable control the back rail

Transporting direction

L→R,L→L，R→L，R→R

Min. PCB size

50mm (X) x 50mm (Y)

Max. PCB size

400mm (X) x340mm (Y)，

PCB thickness

0.4mm -  5 mm

PCB weight

≤3kg

PCB  warping

≤1% of diagonal

PCB fixing

Flex edge clamping

Clearance under PCB

≤18mm

Vision system

Description

Multi-function image process syestem

Mark point software measurement, secondary positioning, component recognition function, digital camera: 1.3 million pixels, camera depth of field: 2mm, FOV:10X8mm

The image positioning system

automatically aligns and teaches, and recognizes the minimum mark point of 0.1 mm

Mark quantity

2 or 4

Mark type

square, circle, triangle, cross, user - defined type

Mark size

0.1mm ~ 3mm

Mark position

Any position on PCB

Mark position compensation

Automatic optical adjustment and search of mark

Light source of camera

Manual adjustment

2D inspection

With the system

Software and communication

Description

Intelligent software backup module

database automatic backup, software upgrade will not be lost

Maintenance warning function

machine screw, slider, motor and other automatic maintenance information prompt 

The intelligent module of printing parameters

selects the type of production PCB and automatically gives the optimal parameter setting

The automatic solder paste recovery system

controls the squeegee to recover the solder paste to the printing stroke with timing or frequency

Standard  configration

Description

Frame

formed as a whole

Control

3 pcs move control cards

Operation system

Windows XP 

Interface

17 inch DELL display, keyboard, mouse，V2 software

Squeegee

straight screw rod/single point suspension squeegee

Squeegee pressure control

Software setting

Stencil auto positioning

The stencil is placed into the support frame, and the squeegee head automatically realizes the stencil plate positioning

Supporting positioning

Supporting block with the same height, pin, plate

Stencil cleaning system

multi-size wiping paper universal, lower paper consumption, cleaner control module

Machine interface for line

SEMI  Input/Output 4 core international standard interface

Machine communication interface

RJ-45LAN(net) and USB2

Warning

three-color intelligent LED warning light 

High precision platform

platform adopts annealing technology + knife fast milling method to reduce the residual metal stress in the platform, which is not easy to deform after long-term use and ensures the accuracy. 

Rapidly platform adjustment system

knob manual quick adjustment of platform height, X,Y, and θaxes are independently adjustment

Intelligent compensation platform

automatic stop pcb device + automatic pcb positioning + left in left out, left in right out, right in right out, right in left out

Manual

Operator manual, installation

Dimension

1140（L）X1360（W）X1505（H）mm

Weight

1100kg

Facility

Description

Power

Voltage：220V，±10%，1 phase, 50/60Hz

Power comsuption

2kw

Air

0.45- 0.6kg/cm²

Temperature on site

25±3℃ 

Humidity

Relative humidity: 30% -  70%

Certification

Description

CE

98/37/EC，89/336/EEC，73/23/EEC

Noise level

Less than 87dB