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SIPLACE X4 S

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SIPLACE X4 S

  • Classification:Siplace

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ASM SIPLACE X4 S Parameters

Gantries: 4

IPC performance: 105,000 cph

SIPLACE benchmark performance: 125,000 cph

Theoretical maximum output performance: 170,500 cph

Machine dimension (L x W): 1.9 x 2.3 m

Pickup rate: ≥ 99,95%

DPM rate: ≤ 3dpm

 

Conveyor

Conveyor type

Single   conveyor

Flexible dual   conveyor

PCB size

Standard

50 x 50 mm - 450 x 560mm

50 x 50 mm - 450 x 320mm

Long board option

50 x 50 mm - 850 x 560mm

50 x 50 mm - 850 x 560mm

PCB thickness

0.3 - 4.5 mm (other sizes can be   customized)

PCB weight

Max. 3.0 kg

Max. 2.0 kg

Conveyor mode: synchronous mode, asynchronous mode

 

Placement head: Siplace SpeedStar, Siplace MultiStar, Siplace TwinStar

Siplace SpeedStar (C&P20 P)

Camera

Type 23 (high-resolution camera)

Type 41 (high-resolution camera)

Component spectrums

01005 to 2220, Melf, SOT, SOD

03015 mm to 2220, Melf, SOT, SOD,   Bare-Die, Flip-Chip

Placement accuracy

(Siplace benchmark value)

± 36 µm/3s

± 36 µm/3s

Angular accuracy

± 0.5° / 3s

± 0.5° / 3s

Max. component height

4 mm

4 mm

Placement   force

1.3 - 4.5 N

1.3 - 4.5 N

Illumination level

5

5

 

Siplace MultiStar (CPP)

Camera

Type 30 (high-resolution camera)

Type 33 (stationary fine-pitch   camera)

Component   spectrums

01005 mm to 27 mm x 27 mm

0402 to 50 mm x 40 mm

Placement accuracy

(Siplace benchmark value)

± 41 µm/3s

± 34 µm/3s

Angular   accuracy

01005 mm to 6 mm x 6 mm

6 mm x 6 mm to 27 mm x 27 mm

± 0.2° / 3s

± 0.5° / 3s

± 0.4° / 3s

Installation   position

Low

High

High

Max. component height

6.0 mm

8.5 mm

11.5 mm

Placement   force

1.0 - 10 N

1.0 - 10 N

Illumination level

5

6

 

Siplace TwinStar (TH)

Camera

Type 33 (stationary fine-pitch   camera)

Type 25 (Stationary flip-chip   camera)

Component   spectrums

0402 to SO, PLCC, QFP, BGA, special   components, bare dies, flip-chips

0201 to SO, PLCC, QFP, sockets, plugs,   BGA, special components, bare dies, flip-chips, shields

Placement accuracy

(Siplace benchmark value)

± 26 µm / 3s

± 22 µm / 3s

Angular accuracy

± 0.05° / 3s

± 0.05° / 3s

Max. component height

25 mm (higher available on   request)

25 mm (higher available on   request)

Placement   force

1.0 N - 15 N

1.0 N - 15 N

Illumination level

6

6

 

Component supply and feeder modules

Feeder slots: 160 8-mm X tape feeder modules

Component Supply:       

SIPLACE component trolley X, SIPLACE Matrix Tray Changer (MTC), Wafflepack Changer (WPC5/WPC6), SIPLACE JTF-S/JTF-M, X tape feeder modules

Alternative feeder module types:

Tray holders, linear vibratory feeders, application-specific OEM feeders

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