K&S HYbrid3 High-Speed Chip Mounter

Kulicke & Soffa (Nasdack Code: KLIC) provides leading semiconductor packaging and electronic assembly solutions for automobiles, consumer electronics, communications, computers and industry worldwide. As a pioneer in the semiconductor industry, K&S has been dedicated to providing customers with market-leading packaging solutions for decades. In recent years, through strategic acquisition and independent research and development, K&S has added advanced packaging, electronic assembly, wedge welding machines and other products, and further expanded the product range of consumables with its core products. Combined with its rich industry expertise, strong technology and R&D strength, Kulicke & Soffa will wholeheartedly help customers meet the challenges of next generation electronic component packaging.

Quality from the first plate means immediate capacity improvement.

By continuously strengthening the whole process of picking and placing, and introducing new lightweight feeder, the pickup rate of iX system can reach 99.99%, the precision of passive component (35 micron) is higher, and the productivity of camera-aligned component can be increased by 25%.

Through software optimization of plant process, iX 302 and iX 502 can easily be added to the customer's factory. The modular design concept simplifies the operation and strengthens the overall control in the mass production environment.

Industry Mounting Control Technology

The uniqueness of iX can strictly control every placement, and has reached the industry's rate of good products, thus minimizing the cost. High quality products enable our users to meet the needs of end customers.

The unique mounting technology is embodied in:

· Advanced PCB collision detection

· No impact force = no component cracking

· Pressure control for placement of closed loop

· Inspection of placement process (according to blue-print value), each placement can be inspected.

· PCB surface mapping enables other placement heads to be mounted without affecting placement height.