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SHENZHEN TOPQUALITY INDUSTRY CO,.LTD

SHENZHEN TEPCO ELECTRONIC EQUIPEMENT CO., LTD.

Contacts:Zhang +86-15811551336

E-mail:zyzhang@topsmt.com


Common Issues and Solutions for Pick-and-Place Machines

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Common Issues and Solutions for Pick-and-Place Machines

Date of release:2024-08-13 Author: Click:

The pick-and-place machine (SMT pick-and-place machine) is a critical piece of equipment in the electronics manufacturing process, used to precisely place surface-mount devices (SMDs) onto circuit boards. Here are some common issues and their solutions:

  1. Machine Fails to Start

    • Check the power connections to ensure they are secure and that the power switch is on.

    • Inspect the fuse or circuit breaker for damage and replace if necessary.

    • If the problem persists, contact the manufacturer or a professional technician to check the control system.

    • Power connection issues

    • Control system malfunction

    • Blown fuse or tripped circuit breaker

    • Possible Causes:

    • Solutions:

  2. Placement Accuracy Issues

    • Check if the vision system and camera are clean and adjust the focus and position.

    • Recalibrate the pick-and-place machine, including alignment and positioning.

    • Inspect and maintain mechanical components such as guides and belts to ensure they are functioning properly.

    • Issues with the vision system or camera

    • Inaccurate calibration

    • Worn mechanical components

    • Possible Causes:

    • Solutions:

  3. Missing Components

    • Check the feeding system to ensure components are being transported correctly, and clean or adjust the feeding mechanism if needed.

    • Inspect the nozzle for blockages or damage, and clean or replace it if necessary.

    • Ensure the component storage bin is adequately stocked and replenish as required.

    • Faults in the feeding system

    • Issues with the pick-and-place nozzle

    • Component storage bin running low

    • Possible Causes:

    • Solutions:

  4. Loose Components

    • Ensure solder paste is applied evenly and allowed to dry sufficiently, avoiding excessively thick or thin layers.

    • Adjust the pressure settings on the pick-and-place machine to ensure adequate pressure to hold components on the PCB.

    • Check solder paste quality to ensure it meets process requirements.

    • Uneven solder paste application

    • Insufficient solder paste drying time

    • Incorrect pressure settings on the pick-and-place machine

    • Possible Causes:

    • Solutions:

  5. Machine Operation Errors

    • Provide thorough training for operators to ensure they are familiar with machine operation procedures.

    • Verify software settings and reconfigure as needed.

    • Check the control panel for proper operation and contact technical support for repairs if necessary.

    • Inadequate operator training

    • Software configuration errors

    • Control panel issues

    • Possible Causes:

    • Solutions:

  6. Alarms or Error Codes

    • Refer to the machine’s user manual to interpret the alarm or error code.

    • Follow the manual’s troubleshooting guidelines or restart the device.

    • If the issue remains unresolved, contact technical support or repair services.

    • Internal equipment faults

    • Software system errors

    • Sensor malfunctions

    • Possible Causes:

    • Solutions:

  7. Vibration or Noise During Operation

    • Check and tighten all mechanical components to ensure they are securely fixed.

    • Inspect the drive system, including motors and belts, for proper operation.

    • Examine and maintain moving parts, replacing any worn components as necessary.

    • Loose mechanical components

    • Drive system faults

    • Worn moving parts

    • Possible Causes:

    • Solutions:

Regular maintenance is crucial to keeping the pick-and-place machine in optimal condition. Address issues promptly and consult professional technicians or equipment manufacturers for complex problems.


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