AOI (Automated Optical Inspection) and SPI (Solder Paste Inspection) are two common inspection technologies in the electronic manufacturing process, each serving different applications and functions.

AOI (Automated Optical Inspection):

Function: AOI is primarily used to inspect the appearance and structure of electronic components or assemblies after soldering.

Application: It uses optical imaging techniques to examine solder joints, component placement, orientation, shorts, opens, and the integrity of electrical components. AOI systems rapidly scan and compare actual products with design files or standards to ensure product quality and manufacturing consistency.

SPI (Solder Paste Inspection):

Function: SPI is primarily used to inspect and assess the quality of solder paste applied to printed circuit boards (PCBs).

Application: Solder paste serves as the connection medium between electronic components and PCBs, making its quality critical for soldering reliability. SPI systems evaluate solder paste thickness, shape, position, and deviations to verify compliance with design specifications and ensure robust soldering connections.

Summary:

AOI is employed to inspect the appearance and structure of assembled electronic products, ensuring the accuracy and quality of soldering and assembly.

SPI is used to inspect the quality and precision of solder paste on PCBs, ensuring reliability and consistency during the soldering process.

These two technologies complement each other in electronic manufacturing, helping manufacturers enhance product quality and production efficiency in high-speed and high-precision environments.