Panel Plating – Stratus™ P500
ECD 510 x 515 mm Panel Processing
Applications
Configurable for up to 5 metals
Multi-chip Fan Out
SoC packages
MicroLED
Features
Wafer level precision hardware and software
Cu, Sn(Ag), Ni & Au plating @<10µm L/S
Single/Dual sided plating
Membrane cells provide high chemistry utilization
Multi-zone anodes for optimized uniformity with thick and thin seeds
Patterned shields for uniform high throughput plating
Substrates
510×515 mm panels, custom
Glass, Composite, Other