Wafer Plating – Stratus™ P300

ECD 300 – 200 mm Wafer Processing

Applications

• Configurable for up to 6 metals

• UBM/RDL

• Fan Out

• RF Filters

• Power Devices

Features

• Dual wafer size capability

• Membrane Cells for long bath stability

• ShearPlate™ technology for thinnest boundary layer

• Substrate handling flexibility

Substrates

• 300 and 200 mm wafers

• Silicon, eWLB, Bonded, Carrier