AB589 Series
The AB589 Series is a revolutionary aluminum wedge bonding solution that caters to a wide range of applications (COB & LED compatible) along with fine pitch capability. Its high precision bonding of a rotary bond head system and high-speed bonding (6.5 wires/s) ensure high UPH. With a patented PR on-the-fly technology, the AB589 conserves your resources with its large and effective bonding area (8” x 6”) and its capability to handle raw PCB and handle multi-machine operations.
Features
High speed wire bonding: 6.5 wires/sec
Fine pitch capability: 55 µm x 65 µm
Innovative PR technology: PR On The Fly
Shorten alignment time
Latest rotary bond head design enhancing stability and reliability
Extra large effective bonding area: 8” x 6”
Supporting various workholder design for full range application
Saving human resources
Capable to handle raw PCB, vertical integrating the production material capability of the entire production line
Saving time of manual load/unload, simplify the bonding, testing and packaging processes
AB589-H Automatic material handling capability (option)
Gold wire wedge bonding capability (option)
Deep access bonding capability
45° bonding angle (option)