Photon Pro
Automatic High Precision Die Bonder
Features
Patented look-through pattern recognition technology
High precision bonding
XY placement: ± 3 µm @ 3σ
Die rotation: ± 0.1° @ 3σ
Large substrate handling, max 200 mm x 215 mm substrate size
Enhance material traceability by using OCR
Multi-chip bonding capability
Auto bond-tool change, up to 10 bond-tool buffers
Auto wafer change, up to 6 x 6” OD Foton Ring with 2-stage ejector system
High flexibility options to fulfill the requirements of diverse multi-chip packages