FIREBIRD Series

Automatic Thermo-compression Bonding System

Features

• Flexible materials handling capability for Heterogeneous Integration in 2D, 2.5D and 3D format

• Co-exist die input from both wafer and tape & reel

• Field configurable for strip / singulated / wafer substrate

• Ultra wide carrier handling for singulated substrate

• Direct wafer and glass substrate handling with SlimFEM

• Reliable with solid installation bases

• > 250 sets installation in mass production

• Innovative process

• Inert environment enables Liquid Phase Contact (LPC) process for high productivity

• Real-time active tip tilt