NUCLEUS Series
Multi-Purpose Precision Pick & Place Tool
Driver of Fan-out and embedded packaging with
Supporting flip chip and direct die attach mode with local and global alignment, including flux dipping
Capable of direct handling of bare wafer substrate, wafer on carrier or substrate on carrier
Support high bond force and thermal process
Multi-chip bonding capability with an automatic tool changing system
Class 100 cleaning standard during bonding
Other configurations catering to the market
NUCLEUS XD with extra large die handling capability up to 70mm x 70mm
NUCLEUS XLplus with extra large substrate handling capability up to 600mm x 670mm