LASER1205
ASMPT’s laser-based wafer separation machines are leading in Edge quality with lowest Cost of Ownership based on VI dicing and/or Matrix grooving processes. ASMPT has developed a broad portfolio of options for all models to address the specific challenges of our customer’s markets, both for OSAT and tier1 IDM companies. Our latest released model is G-UV-USP which is used for Grooving applications in the Memory market.
| Grooving UV-USP | Grooving UV | Dicing UV UVP | Dicing IR | |
|---|---|---|---|---|
| Process | Grooving | Grooving | Dicing & Grooving | Dicing |
| Kerf check on the fly | Yes | Yes | Yes | No |
| Wavelength | 343nm | 355nm | 355nm | 1064nm |
| Pulse length | ps/fs | ns | ns | ns |
| Wafer thickness | 60 - 800µm | 60 - 800µm | 20 - 200µm | 50 - 300µm |
| Wafer size | Up to 12" | Up to 12" | Up to 12" | Up to 12" |