Wafer Sputtering – Apollo 300

PVD 200-300 mm Wafer Processing

Applications

• Configurable for up to 5 metals

• UBM/RDL

• Fan Out

• RF Filters

• Power Devices

Features

• True Bridge tool capability: Size Change

• Degas/Anneal

• ICP/CCP Etch

Substrates

• 200 and 300 mm wafers

• Warped and heavy wafer processing

• Silicon, EMC, RCP, Glass, Bonded