Model ID | DT401-M |
Model No. | KXF-E53C |
PCB dimensions | L 50 mm x W 50 mm ~ L 330 mm x W 250mm |
Placement speed | 0. 7s/chip (tape or bulk) 0. 8s/QFP (single tray) 1. 2s/QFP (twin tray) |
Placement accuracy | ±50um（chip） ±35um（QFP） |
Component dimensions | 1005 chip - L100mm x W90mm x T25mm |
PCB exchange time | 2. 0s |
Electric source | 三相 AC200 - 400v, 1. 7kVA |
Pneumatic source | 0. 49MPa, 150L/m (A. N. R) |
Dimensions | W 1 260 mm x D 2 512 mm x H 1 430 mm |
Mass | 1400KG |
Operation rate improved by direct tray feeder and feeder batch exchange cart
Direct pickup
The placement heads pick up the tray components directly. This enables many and varied odd-shaped components to be mounted at high-speed.
Tray feed during operation
Using the replenisher unit installed above the tray feeder, tray feed can be performed when the components run out without having to stop the production.
Feeder collective-exchange cart
This enables all the tape feeders to be changed collectively during changeover.
Load control head supplied as standard
The series of 3 load control heads yields a maximum load of 50 N which enables almost all insertion connectors to be mounted.
High-quality placement for IC package via the 3D sensor
High-speed detection via batch scanning.