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ASM Siplace X3 S
  • ASM Siplace X3 S
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    Detailed

    SIPLACE X3 S Parameters

     

    Gantries: 3

    IPC performance: 78,100 cph

    SIPLACE benchmark performance: 93,750 cph

    Theoretical performance: 127,875 cph

    Machine dimension (L x W): 1.9 x 2.3 m

    Pickup rate: ≥ 99,95%

    DPM rate: ≤ 3dpm

     

    Conveyor

    Conveyor type

    Single conveyor

    Flexible dual conveyor

    PCB   size

    Standard

    50 x   50 mm - 450 x 560mm

    50 x   50 mm - 450 x 320mm

    Long   board option

    50 x 50   mm - 850 x 560mm

    50 x 50   mm - 850 x 560mm

    PCB   thickness

    0.3 -   4.5 mm (other sizes can be customized)

    PCB weight

    Max.   3.0 kg

    Max.   2.0 kg

    Conveyor mode: synchronous mode, asynchronous mode

     

    Placement head: Siplace SpeedStar, Siplace MultiStar, Siplace TwinStar

    Siplace SpeedStar (C&P20 P)

    Camera

    Type   23 (high-resolution camera)

    Type   41 (high-resolution camera)

    Component spectrums

    01005   to 2220, Melf, SOT, SOD

    03015   mm to 2220, Melf, SOT, SOD, Bare-Die, Flip-Chip

    Placement   accuracy

    (Siplace   benchmark value)

    ± 36   µm/3s

    ± 36   µm/3s

    Angular accuracy

    ± 0.5°   / 3s

    ± 0.5°   / 3s

    Max. component   height

    4 mm

    4 mm

    Placement force

    1.3 -   4.5 N

    1.3 -   4.5 N

    Illumination   level

    5

    5

     

    Siplace MultiStar (CPP)

    Camera

    Type   30 (high-resolution camera)

    Type   33 (stationary fine-pitch camera)

    Component spectrums

    01005   mm to 27 mm x 27 mm

    0402 to   50 mm x 40 mm

    Placement   accuracy

    (Siplace   benchmark value)

    ± 41   µm/3s

    ± 34   µm/3s

    Angular accuracy

    01005   mm to 6 mm x 6 mm

    6 mm x   6 mm to 27 mm x 27 mm

    ± 0.2°   / 3s

    ± 0.5°   / 3s

    ± 0.4°   / 3s

    Installation position

    Low

    High

    High

    Max.   component height

    6.0 mm

    8.5 mm

    11.5   mm

    Placement force

    1.0 -   10 N

    1.0 -   10 N

    Illumination   level

    5

    6

     

    Siplace TwinStar (TH)

    Camera

    Type   33 (stationary fine-pitch camera)

    Type   25 (Stationary flip-chip camera)

    Component spectrums

    0402 to   SO, PLCC, QFP, BGA, special components, bare dies, flip-chips

    0201 to   SO, PLCC, QFP, sockets, plugs, BGA, special components, bare dies,   flip-chips, shields

    Placement   accuracy

    (Siplace   benchmark value)

    ± 26   µm / 3s

    ± 22   µm / 3s

    Angular accuracy

    ± 0.05°   / 3s

    ± 0.05°   / 3s

    Max.   component height

    25 mm   (higher available on request)

    25 mm   (higher available on request)

    Placement force

    1.0 N -   15 N

    1.0 N -   15 N

    Illumination   level

    6

    6

     

    Component supply and feeder modules

    Feeder slots: 160 8-mm X tape feeder modules

    Component Supply:       

    SIPLACE component trolley X, SIPLACE Matrix Tray Changer (MTC), Wafflepack Changer (WPC5/WPC6), SIPLACE JTF-S/JTF-M, X tape feeder modules

    Alternative feeder module types:

    Tray holders, linear vibratory feeders, application-specific OEM feeders

     


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