ASM SIPLACE TX series sets the records in placement performance, floorspace performance and placement accuracy in the high-speed segment, which is the first mounter that is capable of placing 0201 (metric) components at top speed.
SIPLACE TX2i Parameters
Placement speed: up to 96,000cph (benchmark), up to 127,600cph (theoretical)
Machine size (length x width x height): 1.00m x 2.23m x 1.45m
Placement heads: SIPLACE SpeedStar (CP20P2), SIPLACE MultiStar (CPP), SIPLACE TwinStar (TH)
Component spectrums: 0.12mm x 0.12mm to 200mm x 125mm
Feeder module: 80 x 8mm tape feeder, JEDEC trays, linear dipping unit, glue feeder
Typical power consumption: 2.0 KW (with vacuum pump)、1.2KW (without vacuum pump)
Compressed air consumption: 120 Nl/min (with vacuum pump)
SIPLACE TX2 Parameters
Placement speed: up to 85,500cph (benchmark), up to 113,600cph (theoretical)
Machine size (L x W x H): 1.00m x 2.25m x 1.45m
Placement heads: SIPLACE SpeedStar (CP20P2), SIPLACE MultiStar (CPP), SIPLACE TwinStar (TH)
Component spectrums: 0.12mm x 0.12mm to 200mm x 125mm
PCB size (L X W): 50mm x 45mm to 550 x 260mm (dual lane)、50mm x 45mm to 550 x 460mm (single lane)
Feeder module: 80 x 8mm tape feeder, JEDEC trays, linear dipping unit, glue feeder
Typical power consumption: 2.0 KW (with vacuum pump)、1.2KW (without vacuum pump)
Compressed air consumption: 120 Nl/min (with vacuum pump)
SIPLACE TX1 Parameters
Placement speed: up to 44,000cph (benchmark), up to 58,483cph (theoretical)
Machine size (L x W x H): 1.00m x 2.25m x 1.45m
Placement heads: SIPLACE SpeedStar (CP20P2), SIPLACE MultiStar (CPP), SIPLACE TwinStar (TH)
Component spectrums: 0.12mm x 0.12mm to 200mm x 125mm
PCB size (L X W): 50mm x 45mm to 550 x 260mm (dual lane)、50mm x 45mm to 550 x 460mm (single lane)
Feeder module: 80 x 8mm tape feeder, JEDEC trays, linear dipping unit, glue feeder
Typical power consumption: 2.0 KW (with vacuum pump)、1.2KW (without vacuum pump)
Compressed air consumption: 70 Nl/min (with vacuum pump)
SIPLACE SpeedStar(CP20P2)
Component spectrums：0.12mm x 0.12mm to 8.2mm x 8.2mm
Component height：4mm
Placement accuracy(3σ)：25μm
Maximum performance(benchmark value)：48,000cph
Placement force：0.5N to 4.5N
SIPLACE MultiStar(CPP)
Component spectrums：01005 to 50mm x 40mm
Component height：15.5mm
Placement accuracy(3σ)：34μm
Maximum performance(benchmark value)：25,500cph
Placement force：1.0N to 15N
SIPLACE TwinStar(TH)
Component spectrums：0201 to 200mm x 125mm
Component height：25mm
Placement accuracy(3σ)：22μm
Maximum performance(benchmark value)：5,500cph
Placement force：1.0N to 30N
Highlights of SIPLACE TX：
New features：
SIPLACE SpeedStar: placement speed 48,000cph, for components up to
8.2 mm x 8.2 mm, placement accuracy up to 25 µm @ 3 sigma
SIPLACE MultiStar: placement speed up to 25,500cph
SIPLACE TwinStar: for special requirement
SIPLACE JEDEC trays: up to 18 JEDEC trays
SIPLACE TX micron: placement accuracy up to 15 µm @ 3 sigma
SIPLACE SpeedStar and SIPLACE MultiStar placement heads can work in the same working area to achieve higher flexibility and placement performance.
Placement force as low as 0.5N for sensitive component.
Touchless placement makes it possible to place highly sensitive component whose weight reaches the maximum placement weight.
New function: SIPLACE Smart Pin Support
Maximum PCB size: 550mm x 460mm