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SIPLACE X4 S
  • SIPLACE X4 S
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    Detailed

    ASM SIPLACE X4 S Parameters

    Gantries: 4

    IPC performance: 105,000 cph

    SIPLACE benchmark performance: 125,000 cph

    Theoretical maximum output performance: 170,500 cph

    Machine dimension (L x W): 1.9 x 2.3 m

    Pickup rate: ≥ 99,95%

    DPM rate: ≤ 3dpm

     

    Conveyor

    Conveyor type

    Single   conveyor

    Flexible dual   conveyor

    PCB size

    Standard

    50 x 50 mm - 450 x 560mm

    50 x 50 mm - 450 x 320mm

    Long board option

    50 x 50 mm - 850 x 560mm

    50 x 50 mm - 850 x 560mm

    PCB thickness

    0.3 - 4.5 mm (other sizes can be   customized)

    PCB weight

    Max. 3.0 kg

    Max. 2.0 kg

    Conveyor mode: synchronous mode, asynchronous mode

     

    Placement head: Siplace SpeedStar, Siplace MultiStar, Siplace TwinStar

    Siplace SpeedStar (C&P20 P)

    Camera

    Type 23 (high-resolution camera)

    Type 41 (high-resolution camera)

    Component spectrums

    01005 to 2220, Melf, SOT, SOD

    03015 mm to 2220, Melf, SOT, SOD,   Bare-Die, Flip-Chip

    Placement accuracy

    (Siplace benchmark value)

    ± 36 µm/3s

    ± 36 µm/3s

    Angular accuracy

    ± 0.5° / 3s

    ± 0.5° / 3s

    Max. component height

    4 mm

    4 mm

    Placement   force

    1.3 - 4.5 N

    1.3 - 4.5 N

    Illumination level

    5

    5

     

    Siplace MultiStar (CPP)

    Camera

    Type 30 (high-resolution camera)

    Type 33 (stationary fine-pitch   camera)

    Component   spectrums

    01005 mm to 27 mm x 27 mm

    0402 to 50 mm x 40 mm

    Placement accuracy

    (Siplace benchmark value)

    ± 41 µm/3s

    ± 34 µm/3s

    Angular   accuracy

    01005 mm to 6 mm x 6 mm

    6 mm x 6 mm to 27 mm x 27 mm

    ± 0.2° / 3s

    ± 0.5° / 3s

    ± 0.4° / 3s

    Installation   position

    Low

    High

    High

    Max. component height

    6.0 mm

    8.5 mm

    11.5 mm

    Placement   force

    1.0 - 10 N

    1.0 - 10 N

    Illumination level

    5

    6

     

    Siplace TwinStar (TH)

    Camera

    Type 33 (stationary fine-pitch   camera)

    Type 25 (Stationary flip-chip   camera)

    Component   spectrums

    0402 to SO, PLCC, QFP, BGA, special   components, bare dies, flip-chips

    0201 to SO, PLCC, QFP, sockets, plugs,   BGA, special components, bare dies, flip-chips, shields

    Placement accuracy

    (Siplace benchmark value)

    ± 26 µm / 3s

    ± 22 µm / 3s

    Angular accuracy

    ± 0.05° / 3s

    ± 0.05° / 3s

    Max. component height

    25 mm (higher available on   request)

    25 mm (higher available on   request)

    Placement   force

    1.0 N - 15 N

    1.0 N - 15 N

    Illumination level

    6

    6

     

    Component supply and feeder modules

    Feeder slots: 160 8-mm X tape feeder modules

    Component Supply:       

    SIPLACE component trolley X, SIPLACE Matrix Tray Changer (MTC), Wafflepack Changer (WPC5/WPC6), SIPLACE JTF-S/JTF-M, X tape feeder modules

    Alternative feeder module types:

    Tray holders, linear vibratory feeders, application-specific OEM feeders

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